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In the area of thermal science Bartlett-Carver and Associates, Inc. is ready to provide you with steady-state, transient, system thermodynamic, and fluid flow analyses that include conduction, convection, advection, and radiation heat transfer processes, phase change materials, liquid and gas flow, and active cooling. In addition to the commonly encountered thermodynamic problems we can assist you in specialized problems including:
- electronics cooling
- cooling systems (active and passive)
- thermal test
- aerodynamic heating/cooling
- process analysis
- energy conservation
- energy audits
- cycle analysis
- vacuum systems
- low density gas flow
Analysis results typically include but are not limited to:
- Temperature contour plots, temperature vs. time plots, and tabular listings
- Animations of hardware heat-up and cool-down
- Thermal time-constant predictions
- Active cooling power draw
- Allowable operating time for temperature sensitive devices
Analyses are performed using detailed modeling techniques employing nodal network (finite difference) and finite element models and/or classical theoretical solutions. Detailed models utilize computer codes such as SINDA, TAP, P/Thermal and the thermal solution modules of NASTRAN and ANSYS to obtain solutions.Thermal models can be constructed through the import of CAD solid model geometry and/or from detailed descriptions or drawings.
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